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High Thermal Conductive Two Component Potting Silicone Adhesive For Industrial Control

China Dongguan Ziitek Electronic Materials & Technology Ltd. zertifizierungen
China Dongguan Ziitek Electronic Materials & Technology Ltd. zertifizierungen
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—— Peter Goolsby

Ich hatte mit Ziitek für 2 Jahre zusammengearbeitet, lieferten sie thermische leitfähige Materialien der hohen Qualität, und Lieferung in der Zeit, empfehlen ihre Phasenänderungsmaterialien

—— Antonello Sau

Gute Qualität, guter Service. Ihr Team geben uns Hilfe und das Lösen immer, Hoffnung, die wir guter Partner ständig sind!

—— Chris Rogers

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High Thermal Conductive Two Component Potting Silicone Adhesive For Industrial Control

High Thermal Conductive Two Component Potting Silicone Adhesive For Industrial Control
High Thermal Conductive Two Component Potting Silicone Adhesive For Industrial Control

Großes Bild :  High Thermal Conductive Two Component Potting Silicone Adhesive For Industrial Control

Produktdetails:
Herkunftsort: China
Markenname: ziitek
Zertifizierung: RoHs
Modellnummer: WIG680-28AB
Zahlung und Versand AGB:
Min Bestellmenge: 25pc
Preis: 0.1-100USD/KG
Verpackung Informationen: 300ml/1PC
Lieferzeit: 2-3 Werktage
Zahlungsbedingungen: TT
Versorgungsmaterial-Fähigkeit: 1000pc/day
Ausführliche Produkt-Beschreibung
Produktname: Hochwärmeleitender Zweikomponenten-Silikonklebstoff für die Wärmeableitung in der Elektronikindustri Anwendung: Wärmeableitung in der Elektronikindustrie
Wärmeleitfähigkeit: 2,8W/(m·K) Dichte (g-/cm³): 2.95
Betriebstemperatur: -45~200℃ Härte (Ufer A): 25
Aussehen: grau Schlüsselwörter: Topfmasse

High Thermal Conductive Two Component Potting Silicone Adhesive For Industrial Control

TIG®680-28AB Series is a two-component high thermal conductivity silicone sealant with room temperature curing, long working time, and flame retardant properties. This product is particularly suitable for sealing capacitors and small electronic devices. Its excellent flexibility properties enable it to provide excellent cushioning protection for coating materials. The low viscosity characteristic enables the thermal conductive sealant to cover the surface more comprehensively, greatly improving the heat transfer efficiency of the heating element or the entire printed circuit board to the metal shell or heat dissipation plate,thereby improving the performance and service life of electronic components.

 

Feature

 
> Good thermal conductivity: 2.8W/mK
> Good insulation performance
> Good elasticity
> Lower shrinkage
> Low viscosity,easy gas emissions
> Good solvent resistance and waterproof performance
> Longer working hours
> Excellent high and low temperature resistance
> No odor release during the curing process

 

Application
 
> Industrial control,transfomer,coil, amplifier, high voltage package,relay, high current junction box,etc
> Heat sink assembly, thermal sensor potting,thermal conductive product potting
> Heat conduction between the battery cell and the cold tube
> LED and power drive potting
 
Typical Properties of TIG®680-28AB Series
Material Properties (Before Curing)
Property Numerical Test Method
Color/Part A White Visual
Color/Part B Gray Visual
Part A Viscosity (mPa.s) 7000 GB/T 10247
Part B Viscosity (mPa.s) 8000 GB/T 10247
Mix Ratio 1:1 Ziitek Test Method
Shelf life 6 months(Unopened) Ziitek Test Method
Cure Schedule
Pot Life @25℃ 30~45 mins Ziitek Test Method
Cure @70℃ 20~30 mins Ziitek Test Method
Cure Material Properties
Color Gray Visual
Hardness (Shore A) 25 ASTM D2240
Density (g/cm³) 2.95 ASTM D792
Recommended Operating temperature (℃) -45 ~200 *****
Flame Rating V-0 UL 94
Thermal Conductivity (W/mK) 2.8 ASTM D5470
Breakdown Voltage (V/mm) ≥8000 ASTM D149
Dielectric Constant @1MHz 6.0~8.0 ASTM D150
Volume Resistivity (Ohm·cm) 1.0x1013 ASTM D257

 

High Thermal Conductive Two Component Potting Silicone Adhesive For Industrial Control 0

Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Kontaktdaten
Dongguan Ziitek Electronic Materials & Technology Ltd.

Ansprechpartner: Dana Dai

Telefon: 18153789196

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