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Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling

China Dongguan Ziitek Electronic Materials & Technology Ltd. zertifizierungen
China Dongguan Ziitek Electronic Materials & Technology Ltd. zertifizierungen
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Ich hatte mit Ziitek für 2 Jahre zusammengearbeitet, lieferten sie thermische leitfähige Materialien der hohen Qualität, und Lieferung in der Zeit, empfehlen ihre Phasenänderungsmaterialien

—— Antonello Sau

Gute Qualität, guter Service. Ihr Team geben uns Hilfe und das Lösen immer, Hoffnung, die wir guter Partner ständig sind!

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Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling

Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling

Großes Bild :  Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling

Produktdetails:
Herkunftsort: China
Markenname: ZIITEK
Zertifizierung: UL and RoHs
Modellnummer: TIF700NU
Zahlung und Versand AGB:
Min Bestellmenge: 1000 Stück
Preis: Verhandlungsfähig
Verpackung Informationen: 1000 Stück/Beutel
Lieferzeit: 3-5work Tage
Zahlungsbedingungen: T/T
Versorgungsmaterial-Fähigkeit: 10000/Tag
Ausführliche Produkt-Beschreibung
Produktname: Ultraweiche, wärmeleitende 6,5-W-Lückenfüllpads für die CPU-/GPU-Kühlung von Computern Kontinuierliche Verwendung Temp: -45 ℃ bis 200 ℃
Wärmeleitfähigkeit und Kompromiss: 6.5W/m-K Dichte: 30,4 g/cc
Härte: 60/27 Shore 00 Farbe: grau
Dicke: 0.020" ((0.5mm) ~0.200" ((5.0mm) Konstruktion: Mit Keramik gefülltes Silikonelastomer
Schlüsselwörter: Ultraweiches Thermo-Gap-Pad Anwendung: Computer-CPU-/GPU-Kühlung

Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling

 

TIF®700NU is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces,and the susceptibility of delicate components to mechanical damage.


Features:

 

> Higt thermal conductivity 6.5W/mK
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

 

Applications


> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

 

Typical Properties of TIF®700NU Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.020~0.030 0.040~0.200 ASTM D374
(0.50~0.75) (1.0~5.0)
Hardness 60 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.5 W/m-K ASTM D5470
6.5 W/m-K ISO22007

 

Product Specifications
Standard Thickness:0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25mm)
Standard Size:16"X16" (406 mmX406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Kontaktdaten
Dongguan Ziitek Electronic Materials & Technology Ltd.

Ansprechpartner: Dana Dai

Telefon: 18153789196

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