Die thermische leitfähige Auflage ist, bearbeitend schauend und sehr gutes. Wir haben keinen Bedarf an anderer thermischer leitfähiger Auflage jetzt!
—— Peter Goolsby
Ich hatte mit Ziitek für 2 Jahre zusammengearbeitet, lieferten sie thermische leitfähige Materialien der hohen Qualität, und Lieferung in der Zeit, empfehlen ihre Phasenänderungsmaterialien
—— Antonello Sau
Gute Qualität, guter Service. Ihr Team geben uns Hilfe und das Lösen immer, Hoffnung, die wir guter Partner ständig sind!
LED street light good performance Thermal Conductive Pad 4.0W/mk Light Green 45 shore 00 The TIF100-40-07S thermally conductive interface materials are applied to fill the air gaps between the heating elements ... Lesen Sie weiter
4.0W/mk high conductivity silicone Thermal Conductive pad -50 to 200℃ TIF120-40-07U for LED floot lighting 27 SHORE 00 The TIF120-40-07U thermally conductive interface materials are applied to fill the air gaps ... Lesen Sie weiter
Natually Tacky Grey 3.15 G/Cc Thermal Conductive Silicone Pad TIF100-40-11U 4.0W For LED Street Lamp The TIF100-40-11U Series thermally conductive interface materials are applied to fill the air gaps between ... Lesen Sie weiter
Excellent performance 2w thermal conductive gap pad TIF140-20-31E with high flexible 2.75 g/cc The TIF140-20-31E thermally conductive interface materials are applied to fill the air gaps between the heating ... Lesen Sie weiter
LED controller ultra soft BLUE Thermal Conductive pad 3 W/M-K silicone gap filler 2.75 g/cc The TIF100-30-12U thermally conductive interface materials are applied to fill the air gaps between the heating ... Lesen Sie weiter
LED Power Supply Thermal Phase Changing Materials Heat sink Thermal Sheet The TIC™810Y Series is low melting point thermal interface material. At 50℃, The TIC™810Y Series begins to soften and flow, filling the ... Lesen Sie weiter
factory supply 2.9g/cc,2.0mmT heat sink pad for Set top boxes ,with fiberglass reinforced for puncture The TIF180-30-11ES is recommended for applications that require a minimum amount of pressure on components. ... Lesen Sie weiter
RoHS compliant ultra soft Memory Modules 2W thermal conductive gap filler 35 shore00 TIF130-20-11E The TIF130-20-11E Series thermally conductive interface materials are applied to fill the air gaps between the ... Lesen Sie weiter
Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad TS-TIF®100C 6050-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and ... Lesen Sie weiter
High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules Product description TIF®100-12-66U Series is an ultra-soft thermal interface ... Lesen Sie weiter