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Produktdetails:
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| Name: | Wärmeleitendes Gap-Filler-Gel mit hoher Wärmeleitfähigkeit für KI-Server und Automobilelektronik | Anwendung: | KI-Server und Automobilelektronik |
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| Farbe: | ROSA | Dauereinsatz Temp: | -40-200 ℃ |
| Schlüsselwörter: | Wärmeleitendes Gel | Dichte (g/cm³): | 3.15 |
| Wärmeleitfähigkeit: | 4,0 W/mK | Flammenbewertung: | UL94 V-0 |
| Konstruktion: | Keramisches gefülltes Siliziummaterial | ||
| Hervorheben: | High thermal conductivity gap filler,Thermal conductive gel for AI server,Automotive electronics thermal gel |
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High Thermal Conductivity Gap Filler Thermal Conductive Gel For AI Server & Automotive Electronics Product Overview TIF® 040-49 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent
Ansprechpartner: Dana Dai
Telefon: +86 18153789196