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1.5W 0.5~5.0mm Thick Thermal Pad Insulator Insulation Materials Elements Thermal Conductive Pad

China Dongguan Ziitek Electronic Materials & Technology Ltd. zertifizierungen
China Dongguan Ziitek Electronic Materials & Technology Ltd. zertifizierungen
Die thermische leitfähige Auflage ist, bearbeitend schauend und sehr gutes. Wir haben keinen Bedarf an anderer thermischer leitfähiger Auflage jetzt!

—— Peter Goolsby

Ich hatte mit Ziitek für 2 Jahre zusammengearbeitet, lieferten sie thermische leitfähige Materialien der hohen Qualität, und Lieferung in der Zeit, empfehlen ihre Phasenänderungsmaterialien

—— Antonello Sau

Gute Qualität, guter Service. Ihr Team geben uns Hilfe und das Lösen immer, Hoffnung, die wir guter Partner ständig sind!

—— Chris Rogers

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1.5W 0.5~5.0mm Thick Thermal Pad Insulator Insulation Materials Elements Thermal Conductive Pad

1.5W 0.5~5.0mm Thick Thermal Pad Insulator Insulation Materials Elements Thermal Conductive Pad

Großes Bild :  1.5W 0.5~5.0mm Thick Thermal Pad Insulator Insulation Materials Elements Thermal Conductive Pad

Produktdetails:
Herkunftsort: CHINA
Markenname: ZIITEK
Zertifizierung: UL and RoHs
Modellnummer: TIF100-02s
Zahlung und Versand AGB:
Min Bestellmenge: 1000 Prozent
Preis: Verhandlungsfähig
Verpackung Informationen: 1000 Prozent/Tasche
Lieferzeit: 3-5 Arbeitstage
Versorgungsmaterial-Fähigkeit: 100000 Prozent/Tag
Ausführliche Produkt-Beschreibung
Produktname: 1,5W 0,5 ~ 5,0 mm dicker Wärmeleblattisolatorisolationsmaterialien Elemente Wärme leitendes Pad Schlüsselwörter: Thermische leitfähige Auflage
Härte: 45 Ufer 00 Dicke: 0.020" ((0.5mm) ~0.200" ((5.0mm)
Wärmeleitfähigkeit: 1,5 W/m-K Dauereinsatz Temp: -45 bis 200°C
Farbe: Grau Anwendung: Thermalmodul Grafikkarten

1.5W 0.5~5.0mm Thick Thermal Pad Insulator Insulation Materials Elements Thermal Conductive Pad

 

The TIF®100-02S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features


> Good thermal conductive: 1.5W/mK 
> Moldability for complex parts
> Soft and compressible for low stress applications
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware

> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Mainboard/mother board
> Notebook

Typical Properties of TIF®100-02S Series
Property Value Test method
Color Gray ******
Construction &Compostion Ceramic filled silicone elastomer ******
Thickness range 0.020"(0.5mm)~0.200"(0.50mm) ASTM D374
Specific Gravity 2.3g/cc ASTM D297
Hardness 45 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage > 5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 1.0 X1012 Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Outgassing(TML) 0.35% ASTM E595
Thermal conductivity 1.5 W/m-K ASTM D5470

 

Product Specification

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.

 

1.5W 0.5~5.0mm Thick Thermal Pad Insulator Insulation Materials Elements Thermal Conductive Pad 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Kontaktdaten
Dongguan Ziitek Electronic Materials & Technology Ltd.

Ansprechpartner: Dana Dai

Telefon: 18153789196

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