logo
Startseite ProdukteThermische leitende Auflage

RoHS Silicone Thermal Conductive Pad GPU Thermal Pads Thermal Gap Pad For Heat Sink 5.0W/MK

China Dongguan Ziitek Electronic Materials & Technology Ltd. zertifizierungen
China Dongguan Ziitek Electronic Materials & Technology Ltd. zertifizierungen
Die thermische leitfähige Auflage ist, bearbeitend schauend und sehr gutes. Wir haben keinen Bedarf an anderer thermischer leitfähiger Auflage jetzt!

—— Peter Goolsby

Ich hatte mit Ziitek für 2 Jahre zusammengearbeitet, lieferten sie thermische leitfähige Materialien der hohen Qualität, und Lieferung in der Zeit, empfehlen ihre Phasenänderungsmaterialien

—— Antonello Sau

Gute Qualität, guter Service. Ihr Team geben uns Hilfe und das Lösen immer, Hoffnung, die wir guter Partner ständig sind!

—— Chris Rogers

Ich bin online Chat Jetzt

RoHS Silicone Thermal Conductive Pad GPU Thermal Pads Thermal Gap Pad For Heat Sink 5.0W/MK

RoHS Silicone Thermal Conductive Pad GPU Thermal Pads Thermal Gap Pad For Heat Sink 5.0W/MK

Großes Bild :  RoHS Silicone Thermal Conductive Pad GPU Thermal Pads Thermal Gap Pad For Heat Sink 5.0W/MK

Produktdetails:
Herkunftsort: China
Markenname: ZIITEK
Zertifizierung: UL and RoHs
Modellnummer: Tif800es
Zahlung und Versand AGB:
Min Bestellmenge: 1000 Prozent
Preis: Verhandlungsfähig
Verpackung Informationen: 1000 Prozent/Tasche
Lieferzeit: 3-5work Tage
Versorgungsmaterial-Fähigkeit: 10000/Tag
Ausführliche Produkt-Beschreibung
Produktname: Rohs Silikon Wärmeleitkissen GPU Wärmekissen Wärmespaltkissen für Kühlkörper 5.0w/mk Dicke: 0,02 ~ 0,2 Zoll (0,50 ~ 5,0 mm))
Anwendung: Wärmedissipationsstruktur für Kühler Breakdown -Spannung: ≥5500 VAC
Dielektrizitätskonstante: 5,5 MHZ Bau u. Compostion: Mit Keramik gefüllte Silikonelastomer
Schlüsselwörter: Wärmekissen Farbe: Grau
Härte: 12 Ufer 00

RoHS Silicone Thermal Conductive Pad GPU Thermal Pads Thermal Gap Pad For Heat Sink 5.0W/MK

 

The TIF®800ES is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


Features:


> Good thermal conductive:5.0W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications

> High compliance adapts to various pressure application environments
> Available in different thickness options


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps

 

Typical Properties of TIF®800ES Series
Color Gray Visual
Construction &Compostion Ceramic filled silicone elastomer ******
Thickness 0.020"(0.5mm)~0.200"(5.0MM) ASTM D374
Specific Gravity 3.3g/cc ASTM D792
Hardness 12 Shore 00 ASTM 2240
Operating Temp -40 to 200℃ ******
Dielectric Breakdown Voltage(V/mm) ≥5500 VAC ASTM D149
Dielectric Constant @1MHz 5.5 MHz ASTM D150
Volume Resistivity ≥1.0x1012 Ohm-meter ASTM D257
Flame rating 94 -V0 UL E331100
Thermal conductivity 5.0 W/m-K  ASTM D5470

 

Products specificatrion

 

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm) with increments of 0.01 inch (0.25 mm).

Product Sizes: 8" x 16"(203mm x406mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided / Double-sided adhesive).
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

RoHS Silicone Thermal Conductive Pad GPU Thermal Pads Thermal Gap Pad For Heat Sink 5.0W/MK 0
Company Profile
 
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Kontaktdaten
Dongguan Ziitek Electronic Materials & Technology Ltd.

Ansprechpartner: Dana Dai

Telefon: 18153789196

Senden Sie Ihre Anfrage direkt an uns (0 / 3000)

Andere Produkte