High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules
Product description
TIF100-12-66U Series thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0.
Features
> Excellent thermal conductivity: 1.2W/mK
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
| Typical Properties of TIF100-12-66U Series |
| Property |
Value |
Test method |
| Color |
Green |
Visual |
| Construction &Compostion |
Ceramic filled silicone elastomer |
***** |
| Thickness range |
0.010"(0.25mm)~0.200"(5.0mm)
|
ASTM D374 |
| Specific Gravity |
2.1 g/cc |
ASTM D297 |
| Hardness |
27±5 Shore 00 |
ASTM 2240 |
| Continuos Use Temp |
-40 to 160℃ |
***** |
| Dielectric Breakdown Voltage(T-1.0mm) |
>5500 VAC |
ASTM D149 |
| Dielectric Constant @ 1MHz |
4.0 |
ASTM D150 |
| Volume Resistivity |
1.0x1012 Ohm-meter |
ASTM D257 |
| Flame rating |
94-V0 |
UL E331100 |
| Thermal conductivity |
1.2 W/m-K |
ASTM D5470 |
Product Specification
Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.
Safe disposal method does not require special protection.The storage condition is low temperature and dry,
away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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