logo
German
Startseite Produktethermischer Gap-Filler

Cooling Gap Filler 2.0W Thermally Conductive Silicone Thermal Pad High Temperature Application

Die thermische leitfähige Auflage ist, bearbeitend schauend und sehr gutes. Wir haben keinen Bedarf an anderer thermischer leitfähiger Auflage jetzt!

—— Peter Goolsby

Ich hatte mit Ziitek für 2 Jahre zusammengearbeitet, lieferten sie thermische leitfähige Materialien der hohen Qualität, und Lieferung in der Zeit, empfehlen ihre Phasenänderungsmaterialien

—— Antonello Sau

Gute Qualität, guter Service. Ihr Team geben uns Hilfe und das Lösen immer, Hoffnung, die wir guter Partner ständig sind!

—— Chris Rogers

Ich bin online Chat Jetzt

Cooling Gap Filler 2.0W Thermally Conductive Silicone Thermal Pad High Temperature Application

Cooling Gap Filler 2.0W Thermally Conductive Silicone Thermal Pad High Temperature Application

Großes Bild :  Cooling Gap Filler 2.0W Thermally Conductive Silicone Thermal Pad High Temperature Application

Produktdetails:
Place of Origin: China
Markenname: ZIITEK
Zertifizierung: UL and RoHs
Model Number: TIF540-20-11U
Zahlung und Versand AGB:
Minimum Order Quantity: 1000pcs
Preis: Verhandlungsfähig
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Ausführliche Produkt-Beschreibung
Products name: Cooling Gap Filler 2.0W Thermally Conductive Silicone Thermal Pad High Temperature Application Thermal conductivity& Compostion: 2.0W/m-K
Specific Gravity: 2.7g/cc Hardness: 27±5 Shore 00
Color: Gray Thickness: 1.0mmT
Continuos Use Temp: -40℃ to 200℃ Application: Electronic Equipment
Keywords: Thermal Gap Filler Construction: Ceramic filled silicone elastomer

Cooling Gap Filler 2.0W Thermally Conductive Silicone Thermal Pad High Temperature Application

 

TIF540-20-11U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features:
> Excellent thermal conductivity 2.0W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses


Applications:

> Cooling components to the chassis of frame
> CPU and GPU processors and other chipsets
> High-performance computing (HPC)

> Industrial equipment
> Network communication devices

> New energy vehicles
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Typical Properties of TIF540-20-11U Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer *****
Specific Gravity 2.7 g/cc ASTM D792
thickness 1.0mmT ASTM D374
Hardness (thickness<1.0mm) 27±5 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Fire rating 94 V0 UL (E331100)
Thermal conductivity 2.0 W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.020"(0.50mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
Cooling Gap Filler 2.0W Thermally Conductive Silicone Thermal Pad High Temperature Application 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Kontaktdaten
Dongguan Ziitek Electronic Materials & Technology Ltd.

Ansprechpartner: Dana Dai

Telefon: 18153789196

Senden Sie Ihre Anfrage direkt an uns (0 / 3000)