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High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

China Dongguan Ziitek Electronic Materials & Technology Ltd. zertifizierungen
China Dongguan Ziitek Electronic Materials & Technology Ltd. zertifizierungen
Die thermische leitfähige Auflage ist, bearbeitend schauend und sehr gutes. Wir haben keinen Bedarf an anderer thermischer leitfähiger Auflage jetzt!

—— Peter Goolsby

Ich hatte mit Ziitek für 2 Jahre zusammengearbeitet, lieferten sie thermische leitfähige Materialien der hohen Qualität, und Lieferung in der Zeit, empfehlen ihre Phasenänderungsmaterialien

—— Antonello Sau

Gute Qualität, guter Service. Ihr Team geben uns Hilfe und das Lösen immer, Hoffnung, die wir guter Partner ständig sind!

—— Chris Rogers

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High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

Großes Bild :  High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

Produktdetails:
Place of Origin: China
Markenname: ZIITEK
Zertifizierung: UL and RoHs
Model Number: TIF100-35-11UF
Zahlung und Versand AGB:
Minimum Order Quantity: 1000pcs
Preis: Verhandlungsfähig
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Ausführliche Produkt-Beschreibung
Products name: High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element Keywords: Thermal Silicone Pad
Hardness: 75 Shore 00 Application: CPU GPU PC Motherboard
Color: Gray Thermal conductivity& Compostion: 3.5W/m-K
Density: 3.0g/cc Thickness: 0.02~0.20inch / 0.5~5.0mmT
Construction: Ceramic filled silicone elastomer Continuos Use Temp: -40℃ to 200℃

High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

 

TIF100-35-11UF thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features:

> Good thermal conductive : 3.5W/mK
> Naturally tacky needing no further adhesive coating

> High compliance adapts to various pressure application environments
> Available in different thickness options

 

Applications
> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> LED TV and lamps

Typical Properties of TIF®100-35-11UF Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer *******
Density 3.0g/cc ASTM D297
Thickness range 0.02~0.20inch / 0.5~5.0mmT ASTM C351
Hardness 75 Shore 00 ASTM 2240
Dielectric Breakdown Voltage >5500 VAC ASTM D412
Operating Temp -40 ~200℃ *******
Dielectric Constant 4.0 MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 3.5W/mK ASTM D5470

Product Specifications
Standard Thickness:

0.02 to 0.20 (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).

 

Standard Size:

8"X16"(203 mm×406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms.

For other thicknesses or moreinformation. please contact us.

High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Kontaktdaten
Dongguan Ziitek Electronic Materials & Technology Ltd.

Ansprechpartner: Dana Dai

Telefon: 18153789196

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