Die thermische leitfähige Auflage ist, bearbeitend schauend und sehr gutes. Wir haben keinen Bedarf an anderer thermischer leitfähiger Auflage jetzt!
—— Peter Goolsby
Ich hatte mit Ziitek für 2 Jahre zusammengearbeitet, lieferten sie thermische leitfähige Materialien der hohen Qualität, und Lieferung in der Zeit, empfehlen ihre Phasenänderungsmaterialien
—— Antonello Sau
Gute Qualität, guter Service. Ihr Team geben uns Hilfe und das Lösen immer, Hoffnung, die wir guter Partner ständig sind!
High Performance Consumer Electronics White Acrylic Adhesive 0.8W/MK Thermal Adhesive Tape With Double-Sided Adhesive The TIA®806 Series is filled with good thermal conductivity ceramic particles, featuring ... Lesen Sie weiter
High Performance Conductive Acrylic TIA800 Series 0.8W/MK Thermal Adhesive Tape With Double-Sided Adhesive The TIA®800 Series is filled with good thermal conductivity ceramic particles, featuring excellent ... Lesen Sie weiter
Fire-Proof High Thermal Conductivity Double-Side Adhesive Tape Heat Transfer Thermal Tape For LED And Heat Sink The TIA™600P Series products are mostly used for bonding heat dissipation fins, microprocessors ... Lesen Sie weiter
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat The TIA® 800FG Series is widely used for bonding heat sinks to microprocessors and other ... Lesen Sie weiter
-40~125℃ Continuous Use Temp Acrylic Thermal Adhesive Tape With Ceramic Filled Silicone Elastomer 0.8W/MK The TIA®808 Series is filled with good thermal conductivity ceramic particles, featuring excellent ... Lesen Sie weiter
High Performance 1.6W/mK Aluminum Foil Double Sided Thermal Adhesive Tape For Power Converter PCB Heat Spreader The TIA® 800AL Series is widely used for bonding heat sinks to microprocessors and other power ... Lesen Sie weiter
Fiberglass Backing Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA® 808FG Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconducto... Lesen Sie weiter
0.8 W/Mk White Thermal Adhesive Tape For Led Fluorescent Lamp The TIA®806 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This ... Lesen Sie weiter
Double - Sided Thermal Adhesive Tape , High Voltage Isolation Thermal Conductive Strong Adhesive Tape The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Lesen Sie weiter
Heatsink Cooling Thermal Insulation Tape Double Sided with Glass Fiber Backing Type 0.8W/mK The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Lesen Sie weiter