Die thermische leitfähige Auflage ist, bearbeitend schauend und sehr gutes. Wir haben keinen Bedarf an anderer thermischer leitfähiger Auflage jetzt!
—— Peter Goolsby
Ich hatte mit Ziitek für 2 Jahre zusammengearbeitet, lieferten sie thermische leitfähige Materialien der hohen Qualität, und Lieferung in der Zeit, empfehlen ihre Phasenänderungsmaterialien
—— Antonello Sau
Gute Qualität, guter Service. Ihr Team geben uns Hilfe und das Lösen immer, Hoffnung, die wir guter Partner ständig sind!
1.5 W/m-K High Temperature LED Gap Pad Thermal Conductive Silicone Pad for Electronic components Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal ... Lesen Sie weiter
Soft and compressible for low stress applications 1.5mmT silicone sheets for Mass storage devices The TIF160-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows ... Lesen Sie weiter
Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhesive TIE®280-25AB is a two-component epoxy resin sealantwithgood thermal conductivity and ... Lesen Sie weiter
Thermal Conductive Silicone Pad 5.0W/MK High-Temperature Insulation Gap Pad GPU Laptop Thermal Gap Filler Pad TIF® 100 5030-05 Series TIF® 100 5030-05 Series is a well-balanced, general-purpose thermal pad ... Lesen Sie weiter
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Thermal Gap Filler Designed To Improve Thermal Conductivity And Extend Service Life Of Electronic Components Product Overview The TIF® 100-30-15S Series is a well-balanced, general-purpose thermal pad offering ... Lesen Sie weiter
Company pfofile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you ... Lesen Sie weiter
Telecommunication Hardware 3.0W/M-K Thermal Gap Fillers Materials With High Thermal Conductivity The TIF®100-30-02US thermally conductive interface materials are applied to fill the air gaps between the heating ... Lesen Sie weiter
0.5mm Thickness Fiberglass Reinforced Thermal Gap Filler Pad with 1.5 W/m-K Thermal Conductivity for Tablet PC Product Overview The TIF® 140FG-05S is engineered for efficient gap heat transfer, filling gaps and ... Lesen Sie weiter