CPU High Thermal Conductivity Die Cut Silicon Thermal Pad for AI Processors AI Servers
The TIF®700PU Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines excellent thermal conductivity with a near-fluid ultimate softness, ensuring perfect flling of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance,and providing superior thermal solutions and physical protection for the most precise and highest heat flux electronic components.
Features
> Excellent thermal conductivity:7.5 W/mK
> Extremely soft,low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> High insulation performance
Applications
> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
| Typical Properties of TIF®700PU Series |
| Property |
Value |
Test method |
| Color |
Gray |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.45 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.020~0.030 |
0.040~0.200 |
ASTM D374 |
| 0.50~0.75 |
1.0~5.0 |
| Hardness |
70 Shore 00 |
27 Shore 00 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant |
4.5 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
7.5 W/m-K |
ASTM D5470 |
| 7.5 W/m-K |
ISO22007 |
Product Specifications
Standard Thickness:0.02" (0.50 mm)~0.20" (5.00 mm) with increments of 0.01" (0.25 mm)
Standard Size: 16"X 16" (203 mmX406 mm)
Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Company profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Ihre Nachricht muss zwischen 20 und 3.000 Zeichen enthalten!
