Die thermische leitfähige Auflage ist, bearbeitend schauend und sehr gutes. Wir haben keinen Bedarf an anderer thermischer leitfähiger Auflage jetzt!
—— Peter Goolsby
Ich hatte mit Ziitek für 2 Jahre zusammengearbeitet, lieferten sie thermische leitfähige Materialien der hohen Qualität, und Lieferung in der Zeit, empfehlen ihre Phasenänderungsmaterialien
—— Antonello Sau
Gute Qualität, guter Service. Ihr Team geben uns Hilfe und das Lösen immer, Hoffnung, die wir guter Partner ständig sind!
Thermal Management Materials 1.5W Silicone thermal gap pad for Chip heat dissipation Company profile Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise ... Lesen Sie weiter
3mm Thickness Thermal Pad Silicone Laptop Die Cuts High Cooling Thermal Heating Pads For Chipset Battery Factory Thermal Pad The TIF7120RUS is recommended for applications that require a minimum amount of ... Lesen Sie weiter
Electric Thermal Silicone Gap Filling Cooling Pad Thermal Absorbing Conductive Insulating Pad Products description The TIF®100-18-56E Series is a well-balanced,general-purpose thermal pad.It offers good thermal ... Lesen Sie weiter
1.2W/Mk Thermal Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad The TIF®100-12-05ES is recommended for applications that require a minimum amount of pressure on ... Lesen Sie weiter
Compressible 1.5w / Mk Thermal Gap Filler , Heat Conductive Materials For Memory Modules Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal ... Lesen Sie weiter
Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules The TIF1200-30-06UF is recommended for applications that require a minimum amount of pressure on components. The ... Lesen Sie weiter
Good Heat Dissipation Thermal Conductive Silicone Gel Thermal Gap Filler Gel For Telecom Industry Company Profile With professional R&D capabilities and many year experiences in thermal interface material ... Lesen Sie weiter
Thermal Interface Material 3.0W Thermal Silicone Pad For New Energy Vehicle Batteries PCB The TIFTM300 Series is recommended for applications that require a minimum amount of pressure on components. The ... Lesen Sie weiter
Fiberglass Reinforced Thermal Gap Pad,Shock Absorbing,Automotive Electronics,1.8 W/m-K,-40 to 160℃ The TIF1180-18-01US is recommended for applications that require a minimum amount of pressure on components. ... Lesen Sie weiter
High conductivity 4w Thermal Conductive Pad 2mmT naturally tacky Silicone Thermal Pad -40 to 160℃ for IGBTs The TIF180-40-16E Series use a special process, with silicone as the base material, adding thermal ... Lesen Sie weiter