Thermal Conductive Pad Designed to Provide Heat Dissipation and Electrical Insulation for High Power Electronic Components

The TIF® 100-11S Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

• Good thermal conductivity: 1.5W/mK
• Moldability for complex parts
• Soft and compressible for low stress applications
• Naturally tacky, requiring no additional adhesive coating
• Available in various thicknesses

• Cooling components to chassis or frame
• High speed mass storage drives
• Heat sinking housing at LED-lit BLU in LCD
• LED TV and LED-lit lamps
• RDRAM memory modules
• Micro heat pipe thermal solutions
• Automotive engine control units
• Telecommunication hardware
• Display cards
• Mainboards/motherboards
• Notebook computers

Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Our thermal conductive materials are widely used in new energy, electronic appliances, transportation, industry, healthcare, communication, and other fields.

Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, demonstrating our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability.

Even though our products undergo strict inspection, if you encounter any issues with parts not working properly, please provide proof and we will help resolve the situation with a satisfactory solution.