Low-volatility Thermal Gap Filler Silicone Pad With High Thermal Conductive 4.0WmK For Heat Transfer In Automotive And Electronic Applications

Product Specifications

Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).

 
The TIF series is available in custom shapes and various forms.
For other thicknesses or more information,please contact us.

Company Profile

Ziitek Electronic Material and Technology Ltd(ZIITEK) has been deeply involved in the field of heat conducting materials for 20 years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market. Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields.

Certifications:

 ISO9001:2015

 ISO14001: 2004 IATF16949:2016

 IECQ QC 080000:2017

 UL  

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete  teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.