Die thermische leitfähige Auflage ist, bearbeitend schauend und sehr gutes. Wir haben keinen Bedarf an anderer thermischer leitfähiger Auflage jetzt!
—— Peter Goolsby
Ich hatte mit Ziitek für 2 Jahre zusammengearbeitet, lieferten sie thermische leitfähige Materialien der hohen Qualität, und Lieferung in der Zeit, empfehlen ihre Phasenänderungsmaterialien
—— Antonello Sau
Gute Qualität, guter Service. Ihr Team geben uns Hilfe und das Lösen immer, Hoffnung, die wir guter Partner ständig sind!
Silicone Thermal Gap Filler 8.0W 2.0mmT The TIF780QE is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low... Lesen Sie weiter
4.5mmT Hardness 20 shore 00 High durability silicone pads for Monitoring the Power Box The TIF1180-32-05US is recommended for applications that require a minimum amount of pressure on components. The viscoelast... Lesen Sie weiter
Thermal Interface Material 3.0W Thermal Silicone Pad For New Energy Vehicle Batteries PCB The TIFTM300 Series is recommended for applications that require a minimum amount of pressure on components. The ... Lesen Sie weiter
LTD Thermal Pad Thermal Conductive Pad Customized Silicon Thermal Insulation Sheet Thermal Pads For CPU The TIF7100RUS is recommended for applications that require a minimum amount of pressure on components. ... Lesen Sie weiter
3mm Thickness Thermal Pad Silicone Laptop Die Cuts High Cooling Thermal Heating Pads For Chipset Battery Factory Thermal Pad The TIF7120RUS is recommended for applications that require a minimum amount of ... Lesen Sie weiter
1.2W/Mk Thermal Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad The TIF®100-12-05ES is recommended for applications that require a minimum amount of pressure on ... Lesen Sie weiter
High-Density conductive thermal pad For CPU The TIF760QE is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low... Lesen Sie weiter
Silicone Thermal Gap Filler Used In Chassis Or Other Heat Dissipation Components The TIF®100-06U Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic ... Lesen Sie weiter
Fiberglass Reinforced Thermal Gap Pad,Shock Absorbing,Automotive Electronics,1.8 W/m-K,-40 to 160℃ The TIF1180-18-01US is recommended for applications that require a minimum amount of pressure on components. ... Lesen Sie weiter
Viscoelastic Thermal Gap Pad, 3.0mmT, 2.5g/Cc, 18 Shore 00 For LED Power Supply UL Recognized 1.5mmT Thermal Gap Pad, 2.5g/cc, 18 Shore 00 for Audio Video Components The TIF1120-18-01US is recommended for ... Lesen Sie weiter