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Thermische leitfähige Auflage

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January 21, 2025
Category Connection: Thermische leitende Auflage
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Tags:
#thermisches leitfähiges Material #thermisch leitfähige Auflage #CPU-Thermalauflage
Brief: Discover the 2W/MK Thermal Conductive Silicone Pad, designed for efficient heat dissipation in CPUs, GPUs, and radiators. This high-performance pad offers excellent thermal conductivity, electrical isolation, and durability, making it ideal for various electronic applications.
Related Product Features:
  • Good thermal conductivity: 2.0W/mK for efficient heat dissipation.
  • Naturally tacky surface eliminates the need for additional adhesive.
  • Soft and compressible for low-stress applications.
  • Available in various thicknesses to suit different needs.
  • Easy release construction for hassle-free installation.
  • Electrically isolating for safe use in electronic devices.
  • High durability ensures long-lasting performance.
  • Compliant with UL94 V-0, SGS, and ROHS standards.
FAQs:
  • What is the thermal conductivity of the TIF™160-20-50E pad?
    The TIF™160-20-50E pad has a thermal conductivity of 2.0W/mK, ensuring efficient heat dissipation.
  • Is the thermal pad electrically isolating?
    Yes, the pad is electrically isolating, making it safe for use in electronic applications.
  • What thicknesses are available for the thermal pad?
    The pad is available in thicknesses ranging from 0.020" (0.51mm) to 0.200" (5.08mm), with custom options available upon request.
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